MoWiLife Project Kick-Off Meeting in Warstein

Infineon Technologies AG, Warstein

The MoWiLife project, dedicated to advancing Silicon Carbide (SiC) technology for industrial applications, enhancing condition and health monitoring, and pushing ultra-wide bandgap semiconductors to the next level, officially launched with a kickoff meeting held at Infineon Technologies AG in Warstein. This ambitious initiative unites 10 partners from 6 European countries, backed by a budget of approximately 4 million euros.

After over a year of project preparation, the partners were excited to meet in person and start to work on a new generation of power modules. The main event was marked by presentations outlining the activities each partner will undertake over the next three years. This includes four pilots with a Technology Readiness Levels (TRL) of at least 5, which will focus on SiC MOSFETs and explore groundbreaking advancements in ultra-wide bandgap technologies for semiconductors with voltage capacities of up to 20kV.